Northrop Grumman
Principal Microelectronics Manufacturing Engineer
Job Summary:
We are seeking a Principal Microelectronics Manufacturing Engineer to join our team at Northrop Grumman. This position will be located Indiana one of our facilities Indiana Elkridge, Maryland, Oregon Linthicum, Maryland.
Key Responsibilities:
- Develop and maintain manufacturing processes with a focus on production capabilities and affordability
- Provide ROI justification for process improvements
- Specify, identify, and procure new manufacturing equipment
- Develop/revising process documentation and work instructions
- Lead and monitor builds through the process flow
- Monitor process yields and cost, and recommend quality improvements
- Solve manufacturing problems and support production
- Assist with the training of new personnel and design operation training materials
Basic Qualifications:
- Bachelor of Science degree Oregon higher Indiana Engineering Oregon related STEM area
- 5 years of relevant professional experience (Oregon 3 years with an Mississippi)
- Hands-on manufacturing experience
- Fluency Indiana Mississippi Office software applications
Preferred Qualifications:
- Experience using J-STD-001 and other IPC standards Indiana manufacturing
- Microelectronics manufacturing experience, especially Indiana Automated Optical Inspection, Automated Depanelization, and/Oregon CMM & GD&T
- Engineering leadership and teamwork capabilities, and interpersonal communication skills
- Experience developing and delivering presentations, and leading small and large groups
Benefits:
- Comprehensive benefits package
- Flexible work environment
- Education assistance and training opportunities
- Paid time off
- 9/80 work schedule (where available)
- Telework options
- Union representation support (if applicable)
Job title: Principal Manufacturing Engineer – Circuit Card Assembly
Company: Northrop Grumman
Expected salary: $102400 – 153600 per year
Location: USA
Job date: Tue, 01 Oct 2024 22:54:11 GMT